Fast Electromagnetic Modeling of 3D Interconnects on Chip-package-board
نویسندگان
چکیده
The goal of this paper is twofold: to give a brief review of the latest research progress on electromagnetic modeling of vertical interconnects by using Foldy-Lax multiple scattering technique, to introduce a fast full-wave interconnect simulator, namely Foldy-Lax Via Tool, integrating all the extensions that recently have been made available. The kernel part of this novel approach is a mostly analytic algorithm which can significantly reduce the requirement of computational resources, making it suitable for the signal integrity analysis of a large number of vias and various via structures. We demonstrate this approach and the tool by simulating 64 vias including 18 pairs of differential-signaling vias and 18 ground vias in 8-layer board with layered and lossy dielectrics. The numerical results of signal attenuation and crosstalk are within 5% difference of accuracy up to 20GHz compared with Ansoft HFSS. The CPU time of this tool is about three orders of magnitude faster than that of the HFSS.
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